Engineer, Senior - Equipment

Staff / Senior Engineer Electrical Facility Engineer)

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Account Sales (Wafer Fab Equipment)

Engineer, Senior (Technology Integration -Wafer-Level Packaging)

Facility Engineering - Electrical 

Mold MPDE Engineer

Responsibilities: <ul><li>Drive cost reductions weed out unwarranted expenses/wastages and improve equipment performance.</li><li>Drive equipment fault investigations and continuous improvement programs to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness.</li><li>Enforce on equipment maintenance controls and execution to conform to work instructions and procedures. Apply hands-on and with deep involvement at work.</li><li>Coach, guide and train engineers and technicians in equipment problem solving and analysis to build up their technical competencies and achieve self-sustenance.</li><li>Manage his team of technicians in providing effective support on production equipment.</li><li>Provide effective equipment trainings to the technicians to build up their technical and skill competencies.</li><li>Ensure non-conformance is dealt with in a proper and effective manner.</li><li>Take accountability of work and possesses strong sense of responsibility and teamwork.</li><li>Manage and control spare parts availability and costs.</li><li>Manage vendor services and supports and ensuring compliance with factory protocol.</li><li>Establish, review, and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines.</li><li>Create technical specification for new and transferred equipment.&nbsp;</li><li>Execute the equipment move-in, installation, set up and buy-off, meeting set timelines.</li><li>Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.</li></ul> Requirements: <ul><li>Minimum bachelor’s degree in electronic or electrical Engineering or equivalent.</li><li>Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance.</li><li>Experience in high volume production of electronics components in an MNC or semi-conductor industry.</li><li>Possess strong technical competencies in his field of study.</li><li>Good knowledge of statistical and quality tools.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with computer systems and proficient with software applications such as MS Power Point, Excel, and Word.</li></ul>

Responsibilities: Operate &amp; Maintenance: <ul><li>Leads safe, compliant operation and maintenance of electrical infrastructure, establishes and controls MOS/SOP with strong change management, maintains accurate technical documentation, partners with Engineering, Operations, and EHS on regulatory compliance, drives risk and safety programs (FMEA, LOTO, arc flash, permits), and ensures full standards compliance and audit readiness.</li></ul> Reliability &amp; Risk Management: <ul><li>Drives root cause analysis for electrical disturbances, leads predictive and preventive maintenance programs, and strengthens system reliability to minimize unplanned downtime.</li></ul> Capacity Planning &amp; Tool Install: <ul><li>Plans and manages electrical load models across fab and facilities operations, ensures proper feeder loading, redundancy, and diversity, and reviews/approves designs while overseeing safe energization and commissioning.</li></ul> Projects &amp; Commissioning: <ul><li>Define acceptance criteria, test protocols, and witness critical tests.</li><li>Manage vendor performance and ensure documentation close out (O&amp;Ms, as builts).</li></ul> Power Quality &amp; Energy Performance: <ul><li>Monitor PQ and deploy mitigations (filters, SEMI F47 ride through, UPS tuning).</li><li>Drive energy efficiency projects (e.g., transformer loading optimization, UPS efficiency, busway losses, smart metering analytics).</li></ul> Requirements: <ul><li>At least a Bachelor’s degree in Electrical Engineering or equivalent.</li><li>Minimum 6 years of related work experience in Electrical Engineering within wafer fab/semiconductor</li><li>Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.</li><li>Direct working experience in wafer fab facilities will be added advantage.</li><li>Possess strong technical competencies in his field of study.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with software applications such as MS Power Point, Excel and Word.</li></ul>

Responsibilities: <ul><li>Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes</li><li>Manage and develop a team of engineers and technicians in a high volume manufacturing environment</li><li>Drive excellence in output, quality, cost, equipment uptime, and safety</li><li>Ensure robust process control, stability, and integration across wet etch and plating operations</li><li>Lead root cause investigations for process, quality, and equipment issues and drive permanent corrective actions</li><li>Drive yield improvement, scrap reduction, and defect reduction through data driven analysis</li><li>Ensure high equipment availability and reliability, particularly for wet benches and plating tools</li><li>Apply and sustain SPC and statistical analysis tools to monitor and improve process performance</li><li>Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues</li><li>Work closely with cross functional teams including Process Integration, Equipment, Quality, and Manufacturing</li><li>Provide technical and operational leadership during crisis situations impacting fab operations</li><li>Ensure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols</li></ul> Requirements: <ul><li>Bachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related discipline</li><li>Minimum 10 years of relevant experience in semiconductor wafer fabrication</li><li>Strong hands on technical expertise in Wet Etch, Electroplating, and related wet processes</li><li>Prior experience in high volume semiconductor manufacturing within an MNC environment</li><li>Strong understanding of:</li><li>Process integration</li><li>Statistical Process Control (SPC)</li><li>Yield improvement and scrap reduction methodologies</li><li>Equipment maintenance strategies for wet benches and plating tools</li><li>Proven people management experience, including coaching, talent development, succession planning, and manpower deployment</li><li>Demonstrated ability to lead root cause analysis and corrective action implementation</li><li>Strong sense of ownership with the ability to work effectively under pressure</li><li>Hands on leadership style with strong problem solving and decision making capabilities</li><li>Excellent communication and cross functional collaboration skills</li><li>Familiarity with statistical analysis tools, Excel, PowerPoint, and Word</li><li>Strong commitment to Environmental Health &amp; Safety (EHS), quality systems, and fab compliance</li></ul>

Responsibilities: Technology Development: <ul><li>Lead and/ or co-work with global process cluster on the development of next generation lithography for microacoustics filter and wafer-level packaging from concept to qualification and manufacturing release.</li><li>Define process requirements, success criteria, design of experiments (DOE), and characterization plans.</li><li>Drive root cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.</li><li>Translate product requirements into process specifications and control strategies.</li></ul>&nbsp;Technology Transfer &amp; Ramp: <ul><li>Work with project leader on technology transfer – from pilot line to high volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.</li><li>Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.</li><li>Work with process cluster on establishing critical process windows, statistical control limits, and ramp readiness criteria.</li><li>Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Engineering (Materials Science, Chemical Engineering, Microelectronics or related fields).</li><li>4+ years of experience in industry environment with broad lithography exposure in handing KrF/ I-line scanner</li><li>Hand-on experiences in metrology including CD-SEM, Overlay, etc.</li><li>Strong lithography skills set on lithography theory, characteristics of photo-resist and corresponding applications, process set-up, optimization and margin improvement.</li><li>Strong skills in DOE, SPC, data analytics, FMEA, troubleshooting.</li><li>Excellent communication, technical documentation, and stakeholder management skills.</li></ul>

Responsibilities: <ul><li>Subject matter expert in signal integrity design, simulation and validation activities through product development cycles</li><li>Establishing signal integrity design performance/functional requirements for new products</li><li>Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.</li><li>Performing PCB design schematic and layout reviews</li><li>Creating actionable recommendations based upon design reviews and simulation results</li><li>Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.</li></ul> Requirements: <ul><li>Bachelor’s degree in Electrical Engineering.</li><li>Experience with interconnect design or experience with connector &amp;/or cable/cable assembly design (high speed twinax/RF cables, direct attach copper (DAC) cables)</li><li>Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent)</li><li>A solid understanding of electromagnetic theory and electrical circuit behavior</li><li>Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.</li><li>Familiarity with printed circuit board design, fabrication and assembly.</li><li>Excellent verbal and written communication skills</li><li>Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies</li><li>Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English</li><li>Individual must be highly motivated, a quick learner, and able to work independently</li></ul>

Responsibilities: <ul><li>Act as the primary account owner, representing company to the customer and the customer internally across all sales-oriented activities.</li><li>Identify customer needs and develop, refine, and implement complex sales strategies to drive sustainable growth.</li><li>Engage existing and new customers to present company products and service offerings.</li><li>Coordinate and lead customer demonstrations in collaboration with Product Business Group representatives.</li><li>Communicate company product roadmaps, capabilities, and value propositions effectively to customers.</li><li>Translate customer technology requirements into actionable insights for internal product and engineering teams.</li><li>Prepare pricing quotations, lead negotiations, and drive deals to closure. Submit complete and accurate documentation to secure order bookings.</li><li>Conduct follow-up activities on accounts receivable to ensure timely payment and financial compliance.</li><li>Maintain structured coverage for all assigned accounts, ensuring strong engagement at multiple stakeholder levels.</li><li>Document and track all customer interactions, including detailed summaries of customer visits.</li><li>Develop and execute customer-specific action plans, ensuring timely follow-through and measurable outcomes.</li></ul> Requirements: <ul><li>Bachelor’s degree in Engineering, Business, or a related field (advanced degree preferred)</li><li>Significant experience in account sales, business development, or technical sales within semiconductor, capital equipment, or advanced manufacturing industries</li><li>Proven ability to manage complex customer accounts and sales cycles</li><li>Strong strategic selling and negotiation capabilities</li><li>Excellent stakeholder management and communication skills</li><li>Ability to translate technical requirements into business solutions</li><li>Ability to travel locally and regionally</li></ul>

Responsibilities: Technology Development <ul><li>Lead and/ or co-work with global process cluster on new process recipes from concept to qualification and manufacturing release.</li><li>Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.</li><li>Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.</li><li>Translate product requirements into process specifications and control strategies.</li></ul> Technology Transfer &amp; Ramp <ul><li>Work with project leader on technology transfer - from pilot line to high‑volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.</li><li>Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.</li><li>Work with equipment team on equipment set-up and process cluster on establishing critical process windows, statistical control limits, and ramp‑readiness criteria.</li><li>Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Engineering (Material Science, Mechanical Engineering, Chemical Engineering, or related fields).</li><li>3+ years of experience in Chemical Mechanical Planarization (Polishing) process engineering, process development, or as process engineer in a high-volume manufacturing fab.&nbsp;</li><li>Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.</li><li>Excellent communication, technical documentation, and stakeholder management skills.</li></ul>

Responsibilities: Technology Development <ul><li>Lead and/ or co-work with global process cluster on the development of next generation lithography for microacoustics filter and wafer-level packaging from concept to qualification and manufacturing release.</li><li>Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.</li><li>Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.</li><li>Translate product requirements into process specifications and control strategies.</li></ul> Technology Transfer &amp; Ramp <ul><li>Work with project leader on technology transfer - from pilot line to high‑volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.</li><li>Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.</li><li>Work with process cluster on establishing critical process windows, statistical control limits, and ramp‑readiness criteria.</li><li>Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Engineering (Materials Science, Chemical Engineering, Microelectronics or related fields).</li><li>4+ years of experience in industry environment with broad lithography exposure in handing KrF/ I-line scanner</li><li>Hand-on experiences in metrology including CD-SEM, Overlay, etc.&nbsp;</li><li>Strong lithography skills set on lithography theory, characteristics of photo-resist and corresponding applications, process set-up, optimization and margin improvement.</li><li>Strong skills in DOE, SPC, data analytics, FMEA, troubleshooting.</li><li>Excellent communication, technical documentation, and stakeholder management skills.</li></ul>

Responsibilities: Operate &amp; Maintenance <ul><li>Leads safe, compliant operation and maintenance of electrical infrastructure, establishes and controls MOS/SOP with strong change management, maintains accurate technical documentation, partners with Engineering, Operations, and EHS on regulatory compliance, drives risk and safety programs (FMEA, LOTO, arc flash, permits), and ensures full standards compliance and audit readiness.</li></ul> Reliability &amp; Risk Management <ul><li>Drives root cause analysis for electrical disturbances, leads predictive and preventive maintenance programs, and strengthens system reliability to minimize unplanned downtime.</li></ul> Capacity Planning &amp; Tool Install <ul><li>Plans and manages electrical load models across fab and facilities operations, ensures proper feeder loading, redundancy, and diversity, and reviews/approves designs while overseeing safe energization and commissioning.</li></ul> Projects &amp; Commissioning <ul><li>Define acceptance criteria, test protocols, and witness critical tests.</li><li>Manage vendor performance and ensure documentation close out (O&amp;Ms, as builts).</li></ul> Power Quality &amp; Energy Performance <ul><li>Monitor PQ and deploy mitigations (filters, SEMI F47 ride through, UPS tuning).</li><li>Drive energy efficiency projects (e.g., transformer loading optimization, UPS efficiency, busway losses, smart metering analytics).</li></ul> Requirements: <ul><li>At least a Bachelor’s degree in Electrical Engineering or equivalent.</li><li>Minimum 6 years of related work experience in Electrical Engineering within wafer fab/semiconductor</li><li>Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.</li><li>Direct working experience in wafer fab facilities will be added advantage.</li><li>Possess strong technical competencies in his field of study.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with software applications such as MS Power Point, Excel and Word.</li></ul>

Responsibilities: <ul><li>Responsible for Design and Developmeant of Mold tooling and Processes to support new product development.</li><li>Own DFM, PFMEA to optimize product design, process design and tooling design, Realizes sample tooling and product samples.</li><li>Determines the most suitable manufacturing concepts related to planned manufacturing quantities, quality requirements and manufacturing location.</li><li>Ensure molds and processes are designed to be capable of producing good quality products efficiently and effectively at the lowest possible cost.</li><li>Ensure projects are completed in a timely manner and properly transferred to manufacturing upon First Article approval complete with documentation.</li><li>Provide cost estimations for new mold tooling and processes.</li><li>Work within a cross-functional team consisting of various process experts.</li><li>Integrate feedback and lessons learned into new molds and molding processes.</li><li>Collaborate with global experts to update and continuously improve operational standards with regard to plastic injection molding.</li><li>Study or Introduce new technologies into process designs to maximize yield and efficiency.</li></ul> Requirements: <ul><li>Degree or Diploma in mechanical/production engineering.</li><li>More than 8 years Mold design, Process and Troubleshooting knowledge / experience.</li><li>Strong knowledge of tool fabrication, tool-steel application/selection, heat treating, and plating/coating.&nbsp;</li><li>Strong knowledge of injection molding processes (Injection, Insert-molding, two-shot, etc.).</li><li>Strong understanding of plastic, injection machine, auxiliary equipment (strip feed, camera, etc).</li><li>Good at Mold flow simulation and analysis.</li><li>Familiar with BTI 5-Step process, and Knowledge of SIM (Scientific Injection Molding).</li><li>Understand tolerance calculations and Geometric Dimensioning and Tolerancing.</li><li>Good project management skill – Ability to work on several projects at once.</li><li>Effective prepare and present Technical knowledge within a group setting.</li><li>Willingness to travel (25% travel).</li><li>Ability to effectively communicate in English – Written and Spoken.</li></ul>

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13 wafer fabrication Jobs found

Engineer, Senior - Equipment

Staff / Senior Engineer Electrical Facility Engineer)

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Account Sales (Wafer Fab Equipment)

Engineer, Senior (Technology Integration -Wafer-Level Packaging)

Engineer, Senior (Process Development -Microacoustics Lithography)

Facility Engineering - Electrical

Mold MPDE Engineer

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Skills

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13 wafer fabrication Jobs found

Engineer, Senior - Equipment

Staff / Senior Engineer Electrical Facility Engineer)

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Account Sales (Wafer Fab Equipment)

Engineer, Senior (Technology Integration -Wafer-Level Packaging)

Engineer, Senior (Process Development -Microacoustics Lithography)

Facility Engineering - Electrical

Mold MPDE Engineer

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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TALENT

COMPANY

Contact Us

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.