Principal R&D/Product DVL Engineer

Responsibilities:&nbsp;<ul><li>Subject matter expert in signal integrity design, simulation and validation activities through product development cycles</li><li>Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers&nbsp;</li><li>Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.</li><li>Driving product development for business success</li><li>Engaging in innovative simulation and test tool improvement and process enhancement</li><li>Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.</li><li>Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences.</li><li>Being an expert in analyzing competitive products and driving internal &amp; competing IP positions</li></ul> Requirements:&nbsp;<ul><li>Bachelor’s degree in Electrical Engineering; Masters Degree preferred</li><li>Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design</li><li>A solid understanding of electromagnetic theory and electrical circuit behavior</li><li>Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)</li><li>Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)</li><li>Expert with high-speed test equipment (VNA, TDR, BERT)</li><li>Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.</li><li>Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces</li><li>Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.</li><li>Experience with physical layer communications systems and architectures.</li><li>Fluent in English (both verbal and written)</li><li>Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.</li><li>Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.</li><li>Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow</li><li>Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures</li><li>Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts</li><li>Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering &amp; manufacturing teams</li></ul>&nbsp;Nice to Have Skills/Experience: <ul><li>&nbsp;Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system</li><li>Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)</li><li>Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English</li><li>Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.</li><li>Six Sigma methodologies or other strong data analytics background.</li><li>Printed circuit board design, fabrication and assembly (Altium, AutoCAD)</li><li>Experience in project leadership, especially as it applies across design, development &amp; manufacturing teams</li><li>Test equipment (oscilloscope, vector network analyzer, BERT)</li><li>Signal conditioning techniques (equalization, amplification)</li><li>Direct customer design and support experience</li><li>Application and test knowledge of high-speed devices and equalization techniques</li></ul>

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Principal R&D/Product DVL Engineer

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Principal R&D/Product DVL Engineer

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