Senior Flip Chip Bonding Process Engineer

Our client operates in the Telecoms Equipment Semiconductors Industry, with its headquarters rooted strongly in the United States. It has branches spread to more than 30 countries, providing employment to more than 45,000 people all over the world. They fall in the Fortune 500 Companies. Their core business is designing and manufacturing semiconductors. They believe in driving digital transformation.

Responsibilities:

Process Engineering & Manufacturing Support:

• Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support:

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Support audit follow-up actions and ensure timely closure of findings.
• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement:

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.
• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Requirements:

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.
• Strong data analysis, problem-solving, and critical thinking skills.
• Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.
• Good planning, organization, and follow-up skills.
• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.
• Proficiency in Microsoft PowerPoint, Excel, and Word.
• Knowledge of statistical and quality tools such as SPC and MSA is preferred.