Product Integration Lead, HIG High Bandwidth Memory

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

Responsibilities:

• Manage technical inputs and drive silicon-to-system alignment using the Success Criteria Document (SCD).
• Collaborate with HBM Architecture, Product Engineering, Systems Engineering, Business Units, Technology Development, Packaging, and Global Quality teams.
• Identify and resolve gaps between HBM product capabilities and system requirements.
• Manage HBM sample planning and delivery aligned with customer and system development timelines.
• Lead technical triage for System and Chip Feature Interaction issues, driving ownership and mitigation plans.
• Manage qualification definitions and late/post-qualification changes through the Change Control Board.
• Drive technical issue resolution while balancing development schedules, risks, and costs.
• Communicate development priorities across HBM teams to ensure system specification compliance.

Requirements:

• Bachelor's or Master's Degree in Electrical Engineering or Computer Engineering.
• 10+ years of experience in Product Engineering, Design Engineering, Yield Enhancement, or related semiconductor engineering disciplines.
• Experience leading product development projects is highly desirable.
• Strong ability to lead complex technical issues to closure through cross-functional collaboration.
• Knowledge of HBM, DRAM devices, semiconductor product development, and system architecture is preferred.
• Excellent communication, stakeholder management, presentation, and technical leadership skills.