Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

Responsibilities:

• Develop and enable advanced package technologies for post-fab wafer finish and assembly processes.
• Improve product quality, yield, productivity, and manufacturing cost.
• Partner with process and product engineering teams to integrate semiconductor technologies.
• Drive yield improvements through package integration innovation, layout optimization, design improvements, and process margin enhancement.
• Collect and analyze data to support design, layout, and integration flow decisions.
• Collaborate with Probe, Yield Analysis, Test, Product Engineering, PWF Engineering, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, and Global Quality teams.
• Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.
• Support product transition from development through qualification into High Volume Manufacturing (HVM).
• Provide Process of Record (POR) and Model of Record (MOR) documentation.

Requirements:

• B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical Engineering, Physics, Materials Science, or related discipline.
• 2+ years of semiconductor process integration experience, preferably in advanced packaging, post-fab wafer finishing, or assembly processes.
• Proficiency in Python, R, and SQL.
• Experience with Visual Basic.
• Knowledge of E3, FDC, and RMS (Recipe Management System).
• Strong statistical analysis, process modeling, SPC, DOE, defect analysis, and dashboarding skills.
• Strong understanding of semiconductor process flows and integration.
• Strong root-cause analysis and complex problem-solving capability.
• Ability to work under tight timelines and limited resources.