Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

Responsibilities:

• Lead Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.
• Optimize manufacturing test coverage for current and future HBM architectures and process nodes.
• Develop, validate, characterize, and qualify next-generation HBM products.
• Support design verification and circuit debug using CAD tools and Verilog simulations.
• Improve manufacturing yield, reduce test time, and optimize device reliability.
• Drive root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.
• Promote innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.
• Mentor engineers and develop technical and project management capabilities within the team.
• Lead technical decision-making, risk analysis, and project prioritization.
• Collaborate with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.

Requirements:

• Bachelor's or Master's Degree in Electrical & Electronics Engineering.
• 8+ years of semiconductor industry experience with Product Engineering experience preferred.
• Strong leadership, circuit analysis, and root-cause problem-solving skills.
• Knowledge of statistics, scripting, and data analysis tools.
• Ability to adapt to technical leadership and people leadership responsibilities.
• Proven collaboration across cross-functional engineering organizations.
• Strong accountability, communication, and presentation skills.
• Passion for mentoring and developing engineering talent.
• Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).