Hybrid Bonding Technology Development Engineer

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

• Design, collect data, analyze, and compile reports on difficult process engineering experiments. Measure film and surface properties, and interpret data. 
• Optimize process to push product performance to HW limit.
• Generate innovative ideas to tackle challenges in hybrid bonding enablement. Guide engineering on prototyping. Perform hardware characterization on a variety of difficult systems.
• Implement new technology, products, and analytical instrumentation.
• Troubleshoot complex problems, perform root cause analysis, and resolve a variety of difficult process engineering issues.
• Generate internal documentation for products, presentations, and technical reports.
• Communicate and engage with customers to resolve complex process engineering issues or concerns, under limited supervision.
• Identify, select, and partner with vendors and suppliers.
• Serve as a resource for junior colleagues; lead project teams, as needed

Requirements:

• Bachelor’s degree in a related field. Higher education is a bonus.
• 3-7 years of related experience .
• Demonstrates conceptual and practical expertise in complex problem solving.
• Innovative & can think out of the box. Passionate on going through iterative process/hardware development testing & learning cycles.